BUSINESS WIRE

Riassunto: Digi International rivelerà il nuovo system-on-module Digi ConnectCore® MP25 per applicazioni di visione artificiale di nuova generazione all'Embedded World 2024

Digi International to unveil the new Digi ConnectCore® MP25 System-on-Module for next-gen computer vision applications at Embedded World 2024. Versatile, wireless and secure system-on-module based on the STMicroelectronics STM32MP25 processor improves efficiency, reduces costs and enables edge processing for innovative new devices. (Graphic: Business Wire)
Digi International to unveil the new Digi ConnectCore® MP25 System-on-Module for next-gen computer vision applications at Embedded World 2024. Versatile, wireless and secure system-on-module based on the STMicroelectronics STM32MP25 processor improves efficiency, reduces costs and enables edge processing for innovative new devices. (Graphic: Business Wire)
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